Multipurpose Tool for the Electronics Lab
- Excellent quality and high material variety due to the UV laser wavelength
- Laser-stabilized in the low energy area for the processing of thin and sensible materials
- Power measurement on the substrate level for process control
- Compact and safe: lab-ready
One System, Multiple Applications
The LPKF ProtoLaser U4 with integrated UV laser is capable of processing a wide variety of materials. It is easy to install and even easier to use. The high pulse energy of the UV laser leads to a residue-free ablation process, resulting in geometrically precise contours.
The LPKF ProtoLaser U4 can structure or cut diverse materials quickly and cleanly. The laser wavelength used makes the UV laser a truly multifunctional tool. A UV laser beam can cut individual boards out of large boards with high precision and no stress, drill holes and micro-vias, and create openings in solder masks. It can cut and structure LTCCs, fired ceramics, ITO/TCO substrates, delicate prepregs, and laminated materials like FR4 or RF-specific substrates.
The processing of various materials is supported by the CircuitPro Advanced software. An extensive materials library supplies the laser parameters for key materials. Because the ProtoLaser U4 works without material contact, tooling costs are a thing of the past. Micro material processing thus benefits from the fine laser beam diameter, the extremely precise focusing along the Z-axis, and the exact control of the processing positions.
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