Vapor Phase Two
The Vapor Phase Two adapts this soldering process and is perfect for small batch production. In contrast to infrared or convection processes, assemblies with high thermal mass, fine pitch structures or temperature sensitive components can be processed without any problems.
A short introduction to vapor phase soldering
Vapor phase soldering – also called condensation soldering – is based on similar physical principles to a heat pipe. An inert liquid is brought above its boiling point, causing a vapor phase to form just above the surface. This liquid is a specially developed medium called Galden® that boils between 230 °C and 240 °C, depending on the type. This newly formed vapor transports energy from the heat source to one or more “heat sinks”. In this case, these heat sinks are your PCB, your components and the applied solder paste.
The vapor condenses on the cooler surfaces first, so it transports a greater amount of energy to those areas and gently heats your board. The solder paste melts as soon as your PCB reaches the appropriate temperature. Also, the maximum temperature it can reach is limited by the boiling point of the Galden®.