LPKF ProtoLaser H4

Best from both worlds on the table: fast and straight drilling without taper also on thick substrates and fastest surface processing with minor to none surface damage.

Main Applications – IR Laser
Precise structuring / ablation /laser etching of conductive metal layers on:

• Standard FR4, single, double-sided, 5-35um Cu
• Some RF materials, PTFE or ceramic filled, double-sided, processed only on a one side
• Dupont Pyralux AC, Al on PET
• ProMask ablation
• Line / Space: 100 µm / 50 µm

 

Mechanical Drilling & Routing

• HF spindle with 60.000 rpm
• Pneumatic collet release
• 1/8” (3,175 mm) collet
• Standard 38mm drill bits and routers
• Magazine for 6 tools
• Automatic tool exchange with depth adjustment
• Seamless workflow on one system (i.e marking drills with laser)

 

Benefits:

• Drilling & routing thicker materials i.e. multilayers
• Straight, smooth holes – THP

 

New CircuitPro RP

• UI based on known CircuitPro for ProtoLasers 3.5
• Newly designed mechanical tool libraries added
• Processes for mechanical drilling and routing added from CircuitPro for ProtoMat
• one system, one software
• Workflow distinguish between laser and mechanical drilling, cutting